SEMICONDUCTOR CLEANROOM FILTRATION

Microelectronics & Semiconductor Air Filtration Solutions

For wafer fabrication, packaging & testing, flat-panel display, photolithography and other ultra-precision manufacturing scenarios, Yiran® provides ULPA ultra-high-efficiency filtration, AMC airborne molecular contamination control and FFU integrated solutions, meeting ISO 3-5 ultra-clean environment requirements in strict compliance with ITRS International Technology Roadmap for Semiconductors extreme air cleanliness standards.

ISO 3-5
Cleanroom Class
≤0.2
NH₃ ppbv
U15-U16
ULPA Rating
1100-2200
FFU Airflow m³/h
Get Semiconductor Solution

Semiconductor Cleanrooms — Micron-Level Protection for Nano-Scale Processes

Semiconductor manufacturing has reached 3nm nodes and below. A single 0.1μm particle can cause wafer defects. Additionally, AMC at ppb-level concentrations of NH₃, SO₂ and VOCs can cause fatal defects such as photoresist T-topping and wafer hazing.

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3nm
Most Advanced Node
🧬
ITRS
International Standard
🔬
0.0035
Particles/ft³ (ISO 3)
💨
60%+
EC Motor Efficiency

Four Major Challenges in Semiconductor Clean Environments

AMC Airborne Molecular Contamination

Semiconductor processes have reached molecular-level sensitivity to airborne molecular contaminants. NH₃, SO₂, H₂S and VOCs can chemically react with photoresist on wafer surfaces, causing T-topping, hazing and gate oxide degradation. ITRS standards require NH₃ ≤0.2ppbv, SO₂ ≤0.05ppbv, total VOCs ≤0.26ppbv, demanding exceptional breakthrough capacity and selectivity from chemical filters.

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Ultra-Pure ISO 3-4 Environments

Core process areas such as photolithography and etching require ISO 3-4 (Class 1-10), meaning per cubic foot of air, ≥0.1μm particles must not exceed 35 and 352 respectively. This demands thousands of FFUs operating 24/7/365 in tens of thousands of cubic meters of cleanroom space. Any performance degradation or leakage from a single ULPA filter can result in yield loss across the entire production line.

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Vibration & ESD Control

Scanner alignment accuracy reaches sub-nanometer levels. Even faint vibrations from FFU fans can impact exposure precision. Additionally, ESD during semiconductor manufacturing can instantly break down nanometer-scale gate oxides. ESD-safe filter and FFU designs, along with low-vibration design, have become mandatory requirements for advanced nodes.

Energy Consumption & O&M Costs

Semiconductor cleanroom FFUs typically number in the thousands, accounting for 40-55% of cleanroom energy use. EC motor retrofit replacing AC motors, ULPA filter low-resistance design to reduce total pressure drop, and extended chemical filter replacement cycles are the three major cost-reduction directions that semiconductor fabs continuously pursue.

Four-Stage Purification + AMC Control — Dual Defense Against Particles & Molecules

Yiran® semiconductor cleanroom solution integrates particle filtration (pre-medium-HEPA-ULPA) with molecular filtration (makeup air/recirculation AMC control), delivering uniform terminal supply via FFUs.

1
Pre-Filtration — Coarse Interception
Intercepts ≥5μm particles · Protects medium filters
RLR G3 Roll-TypePAR G4 Panel
In semiconductor cleanroom MAUs, RLR series automatic roll filters provide continuous media refreshment without frequent shutdowns, ideal for new fab sites and industrial zones with high atmospheric dust. Media width 1-2m, roll length 20-30m, automatic controller based on pressure or time settings.
2
Medium Filtration + AMC Chemical
Particle filtration F7 → Molecular contamination removal
EFL F7 BagCGD AMC ChemicalHSB Mixed Media
Post pre-filtration air in MAU enters EFL F7 bag filters, then CGD chemical stages. CGD utilizes dedicated media for different AMC types: acid gases (SO₂/H₂S/NOx) use impregnated activated carbon or alumina, alkaline gases (NH₃/amines) use acid-impregnated media, VOCs use high-iodine activated carbon. HSB mixed-bed design simultaneously removes acidic and alkaline contaminants.
3
Sub-HEPA Pre-Filtration
Protects FFU terminal · Extends ULPA life
VCP F9 Compact Sub-HEPA
VCP compact F9 sub-HEPA filters installed in return air shafts or MAU supply sections serve as pre-protection for FFU terminal ULPA. VCP F9 initial resistance only 85Pa, high pleat density provides maximum filter area and dust-holding in limited space. This stage removes >90% of ≥0.5μm particles, reducing FFU ULPA dust load by 60-70% and extending life 2-3×.
4
FFU Terminal — ULPA Ultra-High Efficiency
ISO 3-4 · Uniform air supply · Low vibration, low noise
ULP U15 ≥99.9995%ULP U16 ≥99.99995%FF Series FFU
FF Series FFU fan filter units integrate ULP Series ULPA filters with EC brushless DC fans. Standard 2×4 ft (1220×610mm), airflow 1100-2200m³/h adjustable (PWM or 0-10V), EC motor efficiency 60%+, unit power 100-370W, noise 48-55dBA. ULP U16 for ISO 3 (3nm/5nm photolithography zones), PTFE ultra-high-efficiency membrane media, initial resistance 145Pa. Each FFU undergoes EN 1822 per-unit scan and airflow uniformity testing. Optional ESD-safe conductive housing.

Semiconductor Cleanroom Recommended Product Parameters

Product SeriesModel ExampleEfficiency RatingStandard Size (mm)Rated Airflow (m³/h)Initial ΔP (Pa)Applicable ClassMedia/Motor
RLR Roll Pre-FilterRLR-2000-G3G3 / ISO Coarse 75%2000(W)×Roll 20m40Synthetic Roll Media
EFL Bag MediumEFL-592-F7F7 / ISO ePM1 60%592×592×3812850110Synthetic Fiber
CGD AMC ChemicalCGD-592-H2SH₂S Capacity ≥12wt%592×592×96200080Impregnated Media
HSB Mixed-Bed ChemHSB-592-HybridAcid+Base Dual ≥90%592×592×96180095Acid+Base Mixed
VCP Compact Sub-HEPAVCP-592-F9F9 / ISO ePM1 85%592×592×292-4V340085Ultra-Fine Glass Fiber
ULP U15 ULPAULP-1220-U15U15 ≥99.9995%1220×610×781800135ISO 4-5Glass Fiber/PTFE
ULP U16 ULPAULP-1220-U16U16 ≥99.99995%1220×610×781500155ISO 3-4PTFE Ultra Membrane
FF FFU UnitFF-U16-2×4-ECU16 ULPA + EC360W1220×610×3701100-2200370Pa TSPISO 3-5EC Brushless Motor

Semiconductor Cleanroom MAU + FFU Typical Configuration

Example: 12-inch wafer fab photolithography zone (ISO 3)

Make-up Air Unit (MAU)
Outdoor Air OA
RLR G3
Roll Pre
EFL F7
Bag Medium
CGD AMC
Chemical
Cool/Heat
±0.5°C ±3%RH
VCP F9
Sub-HEPA
OA → RLR auto-roll (continuous refresh) → EFL F7 medium → CGD chemical (NH₃/SO₂/VOCs removal) → Precision temp/humidity (23±0.5°C, 45±3%RH) → VCP F9 sub-HEPA → Into cleanroom return plenum
Cleanroom Recirculation FFU
Return Plenum
MAU + Recirc
FF FFU
ULP U16 + EC
Unidirectional
0.35m/s
ISO 3
Photo Zone
Perf Floor
Return
Return Shaft
Back to Plenum
FFU coverage 100% (ISO 3), each U16 ULPA ensures terminal cleanliness, EC motor 0-100% stepless speed control. Return air passes through VCP F9 pre-filter in shaft before re-entering FFU, forming closed loop.

Yiran® FFU vs. Leading International Brands

Based on 2×4 ft FFU (1220×610mm), U16 ULPA + EC motor, rated airflow 1800m³/h

Comparison ParameterYiran® FF-U16-ECLeading Intl Brand ALeading Intl Brand BYiran® Advantage
ULPA Efficiency (MPPS)≥99.99995% U16≥99.9995% U15≥99.99995% U16Eq./Superior
Unit Power (1800m³/h)260 W310 W280 W7-16% Savings
Total Static Pressure370 Pa380 Pa360 PaMeets Demand
Noise @1m52 dBA55 dBA53 dBA2-3dBA Lower
EC Motor Efficiency62%58%60%+2-4%
AMC Capacity (CGD NH₃)8wt%6wt%7wt%+14-33%
Annual Energy/Unit (24/7)2,278 kWh2,716 kWh2,453 kWh7-16% Savings

* Test conditions: 23°C/45%RH. FFU power at filter initial state; energy comparison based on 24/7/365 continuous operation.

Typical Application Scenarios

Case 1: 12-Inch Wafer Fab Cleanroom
Hefei · 28nm Logic · 32,000m² Cleanroom
  • Background: New 12-inch foundry, photo zone ISO 3 (1,800m²), etch/thinfilm ISO 4 (8,500m²), support ISO 5-6
  • Solution: MAU: RLR G3 + EFL F7 + CGD AMC (H₂S/SO₂/NH₃ triple media) + VCP F9; FFU: FF U16/U15 × 4,860 units

Key Results:

  • ISO 3 photo zone ≥0.1μm particles stable at ≤10/ft³ (far below 35 limit)
  • AMC: NH₃ <0.15ppbv, SO₂ <0.03ppbv, VOCs <0.18ppbv (all exceed ITRS)
  • FFU EC motors save ~2,800,000kWh/year vs. comparable AC solution
  • CGD chemical filter replacement 18 months (typical 12-14), 25% lower annual maintenance
Case 2: OLED Panel Fab Upgrade
Shenzhen · G8.5 Gen · Array+Evaporation Upgrade
  • Background: OLED fab evaporation zone high defect rate (8.3%), investigation found AMC exceedance and FFU U15 efficiency decline
  • Solution: Added MAU CGD chemical stage (HSB mixed bed); replaced 820 aging FFUs with FF U16+EC motors

Key Results:

  • Evaporation defect rate from 8.3% to 4.1%, 50.6% reduction, ~230M CNY annual added output value
  • Replaced FFUs average power down 18%, ~1,050,000kWh/year savings
  • Online AMC monitoring with <5min alarm response

Get Your Semiconductor Cleanroom Solution

Yiran® semiconductor technical experts will contact you within 24 hours with ISO 3-7 cleanroom and AMC control customized solutions.