Data center liquid cooling, hydrogen equipment, semiconductor manufacturing, food & pharma — delivering clean, ultra-reliable specialty sealing for next-generation industry
AI computing explosion, hydrogen industrialization, chip self-sufficiency, biopharma innovation — each track demands unprecedented sealing requirements.
Single-rack power exceeds 40kW; one liquid-cooling pipe leak can cause millions in losses
H₂ molecules are extremely small; conventional seals suffer embrittlement and permeation leakage under high-pressure hydrogen
Semiconductor wafer manufacturing requires seal outgassing particles and organic volatiles below PPB levels
Food & pharma equipment seal materials must pass biocompatibility testing; no harmful substance release
Each operating condition corresponds to a proven product combination — not standalone sales. Full technical support from selection to installation.
FusiSeal liquid cooling seal assemblies: FFKM/EPDM O-rings + PTFE quick-connect seals. For cold plate/immersion cooling circuits, long-term glycol coolant resistance -40~200°C.
ApexSeal hydrogen seal assembly: Inconel 718 metal C-ring + FFKM spring seal. For HRS compressors, storage tanks, fuel cell stacks. ISO 19880-3 hydrogen compatibility tested.
Perfluoroelastomer FFKM O-ring + PTFE spring seal combination: Ultra-High Purity grade. RGA and ICP-MS tested, meeting SEMI F57 cleanliness.
SEP + MPH + ULP UltraPure series, U15~U17 grade. For semiconductor cleanroom AMC control, pharma aseptic filling, biosafety labs — ISO Class 3 (Class 1) cleanliness.
FF/AP series: FFU integrated HEPA/ULPA filter + EC fan, plug-and-play. For data center fresh air, semiconductor micro-environments, modular cleanroom rapid deployment.
Every plant has unique operating conditions. Our application engineering team can visit your site for measurement, media analysis, and operating condition assessment to provide targeted seal selection and failure analysis.
Contact Application Engineers